Applied Materials, Inc. advanced the state-of-the art in photomask technology with its new Applied Centura Tetra EUV Advanced Reticle Etch system. Overcoming a major hurdle to the adoption of EUV1 lithography, the new Tetra EUV system solves the critical and unmet challenge of etching the new EUVL photomasks with nanometer-level accuracy and world-class defect performance to enable the fabrication of multiple new generations of high-performance semiconductor chips. “Our new Tetra EUV sy...